Samsung Exynos 9820
Here you can purchase a high resolution floorplan die shot of the Samsung Exynos 9820 application processor which was extracted from the Samsung Galaxy S10 (see teardown here). This package…
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HiSilicon Kirin 980 SoC
Recently we have torn down the Huawei Mate 20 model HMA-L29 which contains Huawei’s own designed Kirin 980. More details regarding this Package-on-Package SoC together with the Samsung SEC 828…
MediaTek MT6750T
The specifications of the CUBOT X18+ smartphone mention MediaTek’s MT6750T as the CPU, but we extracted it and revealed it as MT6750V. The MT6750V CPU has four 1,5GHz Cortex-A53 and…
338S00309 PMIC Dialog D2422B
Used as a Power Management IC in the iPhone 8. Outside package showed 338S00309 laser marking. The exposed die revealed a D2422B from Dialog Semiconductor. Below 800 pixel images are…
Cirrus Logic 338S00295
These Class D Audio Amplifiers from Cirrus Logic are used in Apple’s iPhone 8 Below 800 pixel images are shown. High resolution floorplan images are available as downloads on the…
Broadcom BC5873A die photo
A nice optical microscopy floorplan image of Broadcom’s BC5873A video to touchscreen I/O controller used in Apple’s iPhone 8 BewarenBewaren
A11 Bionic APL1W72
Recently we have torn down the iPhone 8 model A1905 which contains a 2GB version of Apple’s own designed A11 Bionic SoC. More details regarding this SoC can be found…
SC14443 microcontroller
A floorplan image like this is a stitched using multiple images with advanced software and an accurate automated optical microscopy stage. You can zoom into this image like you are…
Apple A4 APL0398 CPU & GPU
This is Apple’s first in house SoC (System on Chip) and it combines an ARM Cortex-A8 CPU with a PowerVR GPU. It is used in iPad and iPhone4 and iPod Touch. For more details you can…
