• HiSilicon Kirin 980

    Huawei’s own silicon design devision HiSilicon has presented the first 7nm chipset Kirin 980 SoC Application Processor for their flagship smartphones Mate 20 and Mate 20 Pro. The Kirin 980…

  • Apple A11 Bionic chip image TMHS09

    Apple’s newest SoC is build on the 10nm FinFET process of TSMC. It has a 64-bit architecture and it delivers a new neural net to support smooth FaceID. It contains…

  • Deep insight of the SC14443 microcontroller

    Dialog Semiconductor’s  (formerly SiTel) single-chip solutions feature a 16-bit CompactRISC™ microcontroller for general processing including power management and non-real-time MMI functionality. A powerful Gen2DSP core processes the audio streams and delivers…

  • Apple’s first own in-house chipset A4 revealed

    Apple’s first in-house System on chip SoC combines an ARM Cortex A8 CPU and PowerVR SGX GPU. It has been used in the first iPad and iPhone 4 and later on…

Kind words from our clients

We have done the fault localization on our device ourselves using Optical Beam Induced Resistance Change (OBIRCH). However we did not have the tools or the skills to do the destructive physical analysis (DPA). These guys of ChipRebel provided us clear images of the root cause but also resolved what kind of contamination it was. They did it accurately and fast. Meanwhile they have done several jobs for us, always satisfying.

Senior Device Engineer

particle shorting gate to source

They have done a terrific job on our multicore HFCBGA 28nm processor. Access for FIB Circuit Edit was only possible by pre-thinning the 700um thick silicon from the backside. Followed by silicon trenching to expose the N-wells to obtain access to the BEOL. It was great to have a company that could deal with all the steps and it really helped us getting our design verified before updating our masks.

Director of development

Backside FIB circuit edit on 28nm node