MediaTek MT6190MV die shot
Straight from the Motorola G73 smartphone teardown. The MediaTek MT6190MV Intermediate Frequency Amplifier IC.… Read the rest
MediaTek MT6369AP die shot
Straight from the Motorola G73 smartphone teardown. The MediaTek MT6369AP PMIC.… Read the rest
Qualcomm PM8350C
Teardown of the OnePlus 10T smartphone revealed among others the Qualcomm P8350C power management chip… Read the rest
Apple / Cirrus Logic audio amplifier iPhone12
Teardown of the iPhone 12 revealed this Apple / Cirrus Logic 338S00537 audio amplifier.… Read the rest
Apple iPad mini 2021 memory
Inside Apple’s A15 Bionic SoC four 1GB LPDDR4X RAM modules are present. One chip is show below:… Read the rest
Exynos 9820
Samsung has presented the Exynos 9820 Application Processor based on Samsung’s own 8nm LPP FinFET process. This is the successor of the Exynos 9810 based on 10 nm proces node. It is used in new Samsung Galaxy smartphones like the … Read the rest
Galaxy S10 teardown
We have received Samsung’s new flagship smartphone the Galaxy S10 the day it officially is released in Europe. As mentioned here it involves two versions of the galaxy S10. North & Latin Americas, China, Japan have a version containing the … Read the rest
Huawei Mate 20 Teardown
The Huawei Mate 20 lite was already released earlier this year but finally we could get our hands on their new flagships the Mate 20 and the Mate 20 Pro. These phones are the first ones featuring the new … Read the rest
HiSilicon Kirin 980
Huawei’s own silicon design devision HiSilicon has presented the first 7nm chipset Kirin 980 SoC Application Processor for their flagship smartphones Mate 20 and Mate 20 Pro. The Kirin 980 is also the first SoC containing ARM Cortex 76… Read the rest
allthesiliconinside a CUBOT X18+ smartphone
We got our hands on the CUBOT X18+ smartphone which is a pretty neat phone with impressive specs for a relatively low budget. As there are several reviews about it’s functionality available we can focus on the inside.
We opened … Read the rest
