chip image

Here you can purchase a high resolution floorplan die shot of the Samsung Exynos 9820 application processor which was extracted from the Samsung Galaxy S10 (see teardown here). This package contains a front- and backside view of the chip. Die marking on the front side is S5E9820A01. For more details about the Exynos 9820 we refer to our blog article


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  • Frontside image is a 3833x4022 300ppi jpeg of 26MB
  • Backside image is a 9300x9760 300ppi jpeg of 142MB
  • This download contains a front- and backside view image

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