Recently we have torn down the Huawei Mate 20 model HMA-L29 which contains Huawei’s own designed Kirin 980. More details regarding this Package-on-Package SoC together with the Samsung SEC 828 K3UH5H5 4GB LPDDR4x RAM can be found here. Die mark of the Kirin 980 is HI3680 V200

On this page you can buy High Resolution floorplan images:

• Floorplan microscopy image frontside of the HI3680 chip perfect for your article, blog or other media application. 3276×2926 pixel; 300 ppi resolution; 17 MB jpeg.
• Floorplan microscopy image backside of the Kirin 980 chip. In case you want to have a microscopic view. 5900×5298 pixel; 300ppi resolution; 58MB jpeg.

Here is how the floorplan images look:

Die shot of the HiSilicon Kirin 980 SoC

Die shot of the HiSilicon Kirin 980 frontside.

For more details we refer to the analysis article of the Kirin 980