Used as a Power Management IC in the iPhone 8. Outside package showed 338S00309 laser marking. The exposed die revealed a D2422B from Dialog Semiconductor. Below 800 pixel images are shown. High resolution floorplan images are available as downloads on the right side.

BewarenBewaren

BewarenBewaren

BewarenBewaren

BewarenBewaren

BewarenBewaren

BewarenBewaren

BewarenBewaren

Free

Change your currency:

[edd_select_currency][/edd_select_currency]
  • a 227 x 2543 jpeg image
  • Both front- and backside view

Payment options:

Payment Options