Huawei’s own silicon design devision HiSilicon has presented the first 7nm chipset Kirin 980 SoC Application Processor for their flagship smartphones Mate 20 and Mate 20 Pro. The Kirin 980 is also the first SoC containing ARM Cortex 76 CPU and Mali G76 GPU. For more technical and functional data of the Kirin 980 AP we refer to articles like this Anandtech article. Meanwhile we carry on to be the first one with die photo’s of this System-on-a-Chip (SoC) device.
During teardown of the Huawei Mate 20 we discovered a chip marked SEC 828 K3UH5H5. As mentioned in the teardown article this is a Package-on-Package (PoP) with the Kirin 980 AP located underneath Samsung’s 4GB LPDDR4X SDRAM modules. After extraction of the Kirin 980 we could have a good look at the die. It revealed die marking HI 3680 V200 as is seen in the images below.
The die size of the Kirin turned out to be smaller than expected namely 74.13mm². For more detail we have high resolution floorplan die shots available here.
That’s all for now, we will proceed having a look at the functional blocks and perform some SEM imaging…stay tuned.