The Huawei Mate 20 lite was already released earlier this year but finally we could get our hands on their new flagships the Mate 20 and the Mate 20 Pro. These phones are the first ones featuring the new 7 nm HiSilicon Kirin 980 SoC. We are particularly interested in the HiSilicon Kirin 980 SoC build by TSMC‘s. More details including high resolution floorplan images of the Kirin 980 can be found here.
Enough about the Kirin 980 let’s proceed with the teardown of the Huawei Mate 20 model HMA-L29. This involves the 128 GB ROM version. Video of the complete teardown is shown here:
Inside the Mate 20 we find the motherboard with Huawei’s HiSilicon as the most represented supplier. The motherboard involves 10 layer multilayer PCB.
Starting with the device marked SEC 828 K3UH5H5. This is a Package-on-package (PoP) containing two devices. First is the SEC 828 K3UH5H5 which is the 4 GB LPDDR4x SDRAM memory. Underneath this memory in the same PoP the Application Processor (AP) is located. This is the HiSilicon Kirin 980.
The device marked SEC 822 KLUDG4U1EA-B0C1 is Samsung’s 128GB eUFS NAND Flash. We see a HiSilicon Hi 6403 audio codec, a 6H02S Y100, a 35L36A B1AE1815, a 9498UK T83206 Z1D808, a M12x6Y2 and a Hi 6523 battery charger.
The backside of the motherboard shows a Hi 1103 GFCV110 which is the WiFI chipset. The Hi 6421 6FCV7-16 YD4021829 power management IC. A Hi 6422 envelope tracker. NXP is the NFC supplier with their 80T37 3403 SSD827. Qorvo has two Front End Modules. The 77033 for the low and very low band. The 77031 for mid and high band. Furthermore there is a Hi 6363 GFC V100 RF transceiver from HiSilicon. And last there is another RF 8129 envelope tracker from Qorvo.
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