We got our hands on the CUBOT X18+ smartphone which is a pretty neat phone with impressive specs for a relatively low budget. As there are several reviews about it’s functionality available we can focus on the inside.

We opened it up and had a look at #allthesiliconinside. See our teardown movie below.

After teardown we had a closer look at te motherboard. It turned out to be a 10 layer PCB and MediaTek is the major chip supplier for the CUBOT X18+. In the two images below we summarized the chip package markings.

Starting with the CPU which is the octa-core MT6750V instead of the MT6750T which is mentioned in the specifications. This is an 64-bit ARM SoC System-on-Chip based on 28nm HPM proces node. It support big.LITTLE technology with 4x 1,5GHz Cortex-A53 and 4x 1GHz Cortex-A53 cores. It is based on 28nm HPM proces node. Besides that is has two ARM Mali-T860 MP2 650MHz GPU cores and full LTE Cat.6 modem functionality. Postersize high resolution floorplan images are available here.

Just beside the processor a 4GB LPDDR3 SDRAM chip from Spectek by Micron Technology is located. This chip marked PB039 contains a stack of four 1GB silicon SDRAM chips. Front end module is the MediaTek MT6625LN taking care of Bluetooth 4.0, Wifi and GPS. As an audio circuit IC we have the 8736 AFAB. LED Flash driver is the 3641E from Awinic. Furthermore we have on the frontside some small components marked D601 H33S, AL61 ACU5 and 3641E AAS2.

On the back of the CUBOT motherboard we have a big 64GB ROM Sandisk module marked SDINADF4. Another MediaTek IC marked MT6353V is responsible for power management. The RF transceiver is a MT6176V chip from again MediaTek. The AP6710M-31 from AIROHA is a Quad-band GSM/EDGE, dual-band TD-SCDMA, TDD LTE transmit and receive Front-end Module. Furthermore we have a 7215-31 power inductor, a 8661 LNAP Analog Digital Converter and again a D601 H33S

On the back of the CUBOT motherboard we have a big 64GB ROM Sandisk module marked SDINADF4. Another MediaTek chip marked MT6353V is responsible for power management. The RF transceiver is a MT6176V chip from MediaTek. The AP6710M-31 from AIROHA is a Quad-band GSM/EDGE, dual-band TD-SCDMA, TDD LTE transmit and Receive Front-end Module. Furthermore we have a 7215-31 power inductor, a 8661 LNAP ADC and again a D601 H33S. We have done a thorough investigation of all the components and estimated a Bill of Materials which can be downloaded here

 

 

 

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Published by ChipRebel

We analyze the latest leading chips mostly used in high end smartphones, tablets, wearable's, gadgets and notebooks. The results are magnificent high resolution images obtained from optical- as well as electron microscopy.

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