iPhone 8 teardown

It’s almost impossible you’ve missed it. Apple has unveiled their new flagship iPhone’s. Apple brings three new iPhone’s to the market, the iPhone 8, the iPhone 8 plus and if we have to believe the summum of all smartphones the iPhone X (pronounce iPhone ten). We are very interested in the A11 Bionic SoC processor which is used in all three models. With exception of the iPhone 8 who has 2GB of RAM and the iPhone 8 and iPhone X will have 3GB. The geekbench results show outstanding performance see this apple insider article. For the iPhone X we need to wait until the 3rd of November. Won’t wait but we’ll open up an iPhone 8 and publish our finding here and on our social channels.

As soon as we had our hands on the brand new iPhone 8 model A1905 we opened it up to have a look inside. See the teardown movie below. After that we had a close look at the motherboard and revealed most of it’s components (see results below). Next step is to decapsulate the A11 Bionic System on a Chip processor en show you all our findings in this article

These images show you a chip overview of the iPhone 8 mainboard

Top side mainboard chip overview of the iPhone 8

On the frontside of Apple’s iPhone 8 mainboard we find: Of course Apple’s own design the A11 Bionic SoC processor. Product code APL1W72 339S00433. Extracting the APL1W72 revealed four memory chips stacked on top of the processor. These are 500MB LDDR4 RAM memory chips from Micron making it a total of 2GB. P10TSML PMB9948P X726L32 baseband processor with X2748 B11C is Intel’s XMM7480 modem. A NXP 80V18 secure NFC module. For the RF Tranceivers we have found Qorvo 76041 W2KK Low-band PAMiD, Avago 8056LE003 Mid-band PAMiD, Avago 8066LC125 High-band PAMiD and a Qorvo 81004 OP7Z  for envelop tracking.

motherboard iPhone 8

Bottom side mainboard chip overview of the iPhone 8

Here is what chips we revealed on the mainboard backside. The Toshiba TSBL227 VC110 a 64GB NAND flash module. 339S00399 SS7703049 WiFi Bluetooth SoC from Murata. Regarding the power management the following chips are involved 338S00309-B0 PMIC, 33800248 and the S3830028. It turned out the 338S00309 is the D2422B chip from Dialog Semiconductor. For charging the following component are involved. NXP’s 1621A1 is a display port multiplexer and the new Broadcom 59355A2TV83G takes care of wireless charging. Furthermore we have two 338S00295 audio amplifiers, a Texas Instruments 78W8PFP, a EPCOS/TDK 25Y3334 D5341 RF switch, a 77367-1 of Skyworks, an Intel 6848 PMIC and an Intel PMB5757  RF transceiver.

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Published by ChipRebel

We analyze the latest leading chips mostly used in high end smartphones, tablets, wearable's, gadgets and notebooks. The results are magnificent high resolution images obtained from optical- as well as electron microscopy.

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